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Multilayer PCBs are a critical component in the world of electronic design, allowing engineers to harness the full potential of PCB layers to achieve high-density interconnects. In modern electronics, the demand for compact, high-performance devices is ever-increasing, and PCB designers are constantly challenged to accommodate more components, tighter routing, and advanced functionalities. The strategic use of PCB layers, with their interwoven networks of copper traces, dielectric materials, and vias, enables the creation of intricate circuits that can accommodate the densely packed components required for today's cutting-edge technology. This paragraph explores the significance of PCB layers in enabling high-density interconnects and the design considerations necessary to optimize their use in achieving compact yet powerful electronic devices.